Technologically leading system for reading in your order data and their production-oriented implementation. Ucam supplies all subsequent processes with production-relevant data.

With our modern drilling machines (X-ray / mechanical / laser) we are able to realize the finest through holes and blind holes for all imaginable applications with highest accuracy.

When laminating Multilayers, we rely on Cedal’s innovative ADARA pressing technology. Advantages are the computer-controlled control and control of all process parameters as well as the high uniformity of the PCB thickness.

High quality and environmental protection through horizontal desmear and direct plating. With a standing wave as well as surge, spray and suction nozzles, the desmear and direct plating process is physically optimally supported. Thus, this technique is particularly well suited for high-pile multilayers with high-aspect ratio holes.

The layout data are exposed to finished blank with laser direct exposure. The advantages are very high registration accuracy and reproducibility.

In our electroplating machine, we manufacture ultrafine printed circuit boards with micro- and blind holes with maximum process reliability.