To dissipate heat on the circuit board, heatsinks are used. These heatsinks are metallic radiators that are firmly connected to the circuit board. Due to the high termal conductivity of metals, the resulting heat is quickly dissipated from the place of origin. By flat application of the heatsink, good dissipation of the resulting heat to the environment can be achieved.
— With copper-heatsinks, a copper surface of 200 μm thickness (typical value) is applied via a prepreg or alternatively via a double-sided adhesive, electrically insulating heat-conducting foil. The copper surface can be electrically-isolated afterwards (upper picture).
— Heatsink by thermal conductivity paste
In the case of heatsinks using thermal conductivity paste, a signle-component heatsink is applied directly by screen printing (picture below).