Based on the drilling data the drill pattern is inserted onto the prepared material according to customer specifications.
After brushing the drilled PCBs, the removal of all smears that have occured during the drilling process is done. After various intermediate steps, activation by palladium occurs. On these palladium-activated surfaces, a direct electrodeposition is possible. Finally, a micro etching of the copper surface is performed for optimum copper-copper adhesion.
Following the directplating process the resist gets laminated. The resist can be structured conventionally, i.e. with film exposure or with direct laser exposure.
The electrodisposition of the copper occurs in the photoresist mask. Then the metal resist (etch protection) is applied.
After removal (stripping) of the photoresist, the PCB is etched. The metal resist can then be removed.
Application of solder resist in curtain coating process. After subsequent exposure and development, the solder resist is cured.
The desired surface is applied according to customer specifications.
The final cutting procedure is made here. Non-plated holes are inserted.
For final testing the finished PCBs are 100% electrically tested on our finger tester against your technical data – quickly, economically and absolutely reliable.